Canteliver Probe Card
MPI Cantilever Probe Card is extensively applied on gold bump and pad wafer screening for Show driver, logic, and memory machine. MPI’s cantilever probes are definitely the corresponding remedy towards the needs of fine pitch, tiny pad size, higher velocity, less cleansing, multi-DUT, large pin depend, and ultra-minimal leakage prerequisites. With superb craftsmanship, ground breaking architecture and demonstrated methodologies depending on mechanical and electrical simulation/measurement results, building MPI the very best cantilever supplier worldwide.
FCB Probe Card
The FCB Probe Card is among the most mature technological innovation of buckling beam probe card. It is aimed to attain the semiconductor ship manufacture time-to-market place (TTM) and value of exam (COT) need. FCB can be a tested solution for various semiconductor generation checks from early engineering pilot-operates to superior quantity production (HVM). FCB is prepared for unit demanding high signal integrity probing (SI) and/or electricity integrity probing (PI). Purposes consist of slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB ensures the whole world’s greatest General Value-of-ownership (COO) for many DUT apps.
EVS Probe Card
The EVS Probe Card is an enhancement in excess of the conventional buckling beam probe card. Critical features are larger existing carrying potential (C.C.C.) and reduced well balanced Make contact with drive (BCF), and also In general MEMS-like features. EVS can certainly meet the necessity of Sophisticated wafer probing. Exact alignment and excellent planarity Command are classified as the vital elements contributing to stable Call resistance. With its capacity and performance, EVS Probe Card is a really perfect option for advanced probe cards.
Osprey probe card
The Osprey probe card is MPI’s Option to demand for at any time finer pitch. It is actually created for smaller sized Al pad, and it is perfect for very small pitch software with peripheral and whole array sample. With exact alignment and greater planarity Command, Osprey can attain bigger efficiency by multi-DUT structure. The forming wire (FW) style needle created with MPI’s own micro fabrication approach not merely delivers substantial-high quality efficiency but additionally lets easy needle replacement and shortens keeping cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle that's designed for the demand of reduced power probing. Furthermore, it comes along with the opportunity to satisfy substantial C.C.C. and substantial pin counts software. The MEMS here course of action makes certain very constant needle characteristics, plus the Particular composition layout enables exact alignment and planarity Command.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/